We are seeking Customer Support who is passionate about solving complex problems for our clients and their client bases. The ideal candidate will have strong attention to detail, be action-oriented, be comfortable working in multiple systems at a time and excels at collaborating with team members from across the company including Onboarding Services, Customer Success, Product Management, and Engineering. This is a great opportunity to engage with clients, intimately learn our solutions and continue to build towards your technology career!
1+ years in a Technical Support or Customer Support Engineering role
Highly developed empathy and emotional intelligence
Experience with support ticketing systems
Excellent communication skills (English)
Experience with ReTool or similar Support tools
Basic understanding of corporate finance — invoices, payments, credit memos etc
Familiarity with relational databases, experience reading and writing SQL queries
Expert using browser consoles and debugging data display, requests and responses
Manage and resolve daily, open customer support inquiries and escalations
Provide detailed analysis and root cause for issues reported up through Tier 1 and Tier 2 Support
Liaise between engineering and our customers to resolve product and/or engineering-related issues
Communicate any system issues and work with Onboarding Services, Customer Success and Engineering on issue resolution
Assist with documentation of customer support processes and procedures
Provide support, as needed, within other areas of the Operations team as directed
From the technology perspective, YayPay Platform is a SaaS offering, which integrates with a number of different systems, such as:
The application currently undergoes the phase of the active new feature development — we are working on building new modules: Reporting & Analytics Module, Credit Module, Cash Application Module.
The application is built on Service-Oriented Architecture, with the use of Kubernetes and technologies around it.
The main technology stack is described below: