ThunderSoft (Stock Code: 300496) is a world leading smart platform technology provider. Headquartered in Beijing, ThunderSoft operates 26+ R&D centers and offices globally.
12 лютого 2020

C++ Intern (вакансія неактивна)

Silicon Valley | US, Київ

Необхідні навички

Strong background in compiler and gdb
— Programming skills in one or more of makefile, Python, Perl, C/C++
— Experienced in RTOS and embedded system
— Strong debugging and problem solving skills

Буде плюсом

— Have a great interest in learning new things and developing yourself
— Have a positive attitude and thrive on new challenges. Be ready to solve problems in creative way
— Know how to find opportunities from challenges, and be ready to be a strong team player and a communicative person, work well independently to make sure in reaching results with high quality and on time
— Know how to find innovative solutions in software and have a passion for Software Development

Пропонуємо

— Engineering culture, attach high importance technical buildup and engineering development
— Global opportunity, any position in other country is appliable if you have competence
— Great prospects of Self-development, Challengeable position, Big room of promotion
— Fast growth, 5000+ staff, 1500+ of them are automotive engineers

Про проєкт

ThunderSoft provides the overall intelligent cockpit software solution and service for automobiles from operating system development, core technology authorization to application customization, including the infotainment system, intelligent dashboard, integrated cockpit, ADAS and audio products, and provides the abundant and advanced intelligent driving experience for drivers and passengers based on several years of operating system optimization technology, excellent 3D engine, machine vision, voice and audio technology since 2013. At present, more than 100 companies adopt the ThunderSoft’s intelligent cockpit products and solutions.

ThunderSoft closely cooperates with the world leading upstream suppliers of automotive electronics, such as Qualcomm, Renasas, Texas Instruments, NXP Semiconductors, ST, QNX, Intel, Baidu and Sony, to provide the complete solutions, tools and services for automobile manufacturers and Tier 1 suppliers, and accelerate and improve the quality and user experience of intelligent Connected Vehicles (ICV), while reducing the time to market of products.

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