Lead Hardware Engineer (Embedded AI & Drone Systems)

​Role Title: Lead Hardware Engineer (High-Speed Digital & HDI Design)

Location: On-site

Contract Type: Project / Full-time

ABOUT THE PROJECT:

We are developing next-generation autonomy systems used by the Armed Forces of Ukraine. If you’re passionate about embedded systems and aerospace-grade innovation, this is your chance to work on something truly impactful.

We are seeking a skilled and driven Software Engineer with expertise in modern C++ to join our advanced engineering team developing autonomous capabilities. You will contribute to mission-critical software systems involving real-time decision-making, sensor integration, and navigation in complex environments.

​Key Responsibilities:

​Architecture & Selection: Select the optimal SoC/SiP (e.g., Rockchip RK3588S/RV1126, Qualcomm QRB series, or TI TDA4) that balances AI TOPs, power consumption, and physical package size.

​Schematic Capture: Design complex schematics involving high-speed differential pairs, DDR4/LPDDR5 memory interfaces, and PMIC power sequencing.

​HDI PCB Layout: execute a multi-layer (10+ layer) PCB design with blind/buried vias, micro-vias, and via-in-pad technology to fit BGA components on a <40mm x 40mm board.

​Video Pipeline Design: Integrate MIPI CSI bridges for Sony IMX sensors and design a low-noise Digital-to-Analog (DAC) circuit for CVBS/Composite video output (OSD/FPV feed).

​Signal & Power Integrity: Perform simulation and routing for impedance-controlled signals (MIPI, USB) and ensure clean power delivery in a noisy drone environment.

​Required Qualifications:

​Senior Experience: 7+ years in embedded hardware design, with a portfolio of “Dense/Miniature” designs (e.g., smartwatches, drone FCs, SoM carriers).

​BGA & HDI Mastery: Proven experience routing fine-pitch BGAs (0.4mm pitch or lower) using HDI stack-ups (Any-layer HDI preferred).

​High-Speed Interfaces: Deep understanding of MIPI CSI-2/DSI, USB 3.1, and PCIe signal constraints.

​SoC Ecosystems: Experience designing bare-metal/Linux boards using Rockchip, NXP i.MX, Qualcomm, or Texas Instruments processors.

​Analog/Mixed Signal: Experience designing clean analog video paths and filtering noise from high-current digital switching.

PREFERRED QUALIFICATIONS:

• Experience with autonomous systems, robotics, or aerospace/defense software development
• Knowledge of sensor fusion, SLAM, guidance and control algorithms, or computer vision
• Familiarity with AI/ML model integration, especially with inference engines (e.g., TensorRT, ONNX Runtime) on edge devices
• Exposure to Model-Based Design (e.g., MATLAB/Simulink) and control system simulation tools
• Experience with DevOps and CI/CD pipelines in a regulated environment
• Working knowledge of any aerospace software standards

SOFT SKILLS & TEAM FIT:

• Strong analytical and problem-solving skills
• Excellent written and verbal communication
• Comfortable working in cross-functional teams under tight deadlines
• Self-motivated, detail-oriented, and able to thrive in high-stakes environments

WHAT WE OFFER

• The opportunity to shape a mission-critical defense technology from the ground up
• Be part of a compact, elite engineering team with full-cycle product ownership
• A fast-paced result-oriented culture where decisions are driven by data and results
• Competitive compensation
• Access to field testing, prototyping labs, and autonomy in solving complex problems
• Direct impact on Ukraine’s national security and technological edge